Basic HTML version of Foils prepared 10 Sept 1996

Foil 9 Chip and Package Characteristics

From New CPS615Master Foils-- 26 August 96 Basic Simulation Track for Computational Science CPS615 -- Fall Semester 96. by Geoffrey C. Fox
Secs 37
1 Overall Roadmap Technology Characteristics from SIA (Semiconductor Industry Association) Report 1994
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© on Tue Oct 7 1997