Basic HTML version of Foils prepared
10 Sept 1996
Foil 9 Chip and Package Characteristics
From
New CPS615Master Foils-- 26 August 96 Basic Simulation Track for Computational Science CPS615 --
Fall Semester 96
.
by
Geoffrey C. Fox
Secs 37
Overall Roadmap Technology Characteristics from SIA (Semiconductor Industry Association) Report 1994
©
on Tue Oct 7 1997
Basic HTML version of Foils prepared 10 Sept 1996
Secs 37