HTML version of Scripted Foils prepared 27 August 1996

Foil 18 Chip and Package Characteristics

From CPS615-Introduction-Course,Driving Technology and HPCC Current Status and Futures CPS615 Basic Simulation Track for Computational Science -- Fall Semester 96. by Geoffrey C. Fox *
Secs 37
1 Overall Roadmap Technology Characteristics from SIA (Semiconductor Industry Association) Report 1994
in Table To:

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